52 thin shrink small outline exposed pad plastic packages (eptssop) a index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 0.05(0.002) top view p1 123 p bottom view n m28.173a 28 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.047 - 1.20 - a1 0.002 0.006 0.05 0.15 - a2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - d 0.378 0.386 9.60 9.80 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.0177 0.0295 0.45 0.75 6 n28 287 a 0 o 8 o 0 o 8 o - p - 0.138 - 3.50 11 p1 - 0.118 - 3.0 11 rev. 1 6/99 notes: 1. these package dimensions are within allowable dimensions of jedec mo-153-aet, issue e. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension e1 does not include interlead flash or protru- sions. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. the chamfer on the body is optional. if it is not present, a vi- sual index feature must be located within the crosshatched area. 6. l is the length of terminal for soldering to a substrate. 7. n is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension b does not include dambar protrusion. allow- able dambar protrusion shall be 0.08mm (0.003 inch) total in excess of b dimension at maximum material condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. controlling dimension: millimeter. converted inch di- mensions are not necessarily exact. (angles in degrees) 11. dimensions p and p1 are thermal and/or electrical en- hanced variations. values shown are maximum size of ex- posed pad within lead count and body size. plastic packages for integrated circuits
|
